This tutorial is for BigShot / Big Kick users and uses the multipurpose platform to cut various brands of wafer thin dies. The Dies in the photograph may look different from the dies you have but the sandwich will be the same as outlined below.
You will need:
Big Shot / Big Kick Machine
2 Cutting Pads
Relevant make of die
Card / Paper
The sandwich is as follows (from bottom to top - as you would build it)
Multipurpose platform open on TAB 2
Add one Cutting Mat
Add your card, if using a patterned or finished card the side you want to use needs to be facing the die as even without embossing the dies you do get a slight embossed pattern on certain dies.
Add the other cutting mat
Now everything is layered up as it should be, the pics above have been staggered so you can see what has been layered up, make sure that your sandwich is neat and everything fully covers the layer below it
Sandwich re-cap (starting from the bottom)
~ MP platform - TAB 2
~ Cutting Plate
~ Die (s)
~ Card (front facing die)
~ Cutting Plate
This is now ready to go through your machine
For the next part of this tutorial which is embossing wafer thin dies in the Big Shot click HERE
I have found some of these dies can be a little hard to clean! and have a few tips to help!
To clear the tiny little bits that are left in the die, please do not tap or bang your die against something like other blogs reccomend, they can easily crack and become damaged, I would also avoid scratching at them with a pokey tool or die pic as this will show up on mirri card if you scratch the die.
Instead i reccomend some scotch or low tack tape, press it on the die and peel away the stuck in bits!!
This tip is also good if the actual die cut shape gets stuck too!
Scuse the terribly-in-need-of-a-fresh-coat-of-paint-nail!!
If I get any questions about this tutorial i will add my responses to the bottom to try and help others who may have the same questions
Don't Forget - for the next part of this tutorial which is embossing wafer thin dies in the Big Shot click HERE