Wednesday, 18 August 2010

Tutorial & Sandwich for Cutting Wafer Thin Dies in the Big Shot Machine


This tutorial is for BigShot / Big Kick users and uses the multipurpose platform to cut various brands of wafer thin dies. The Dies in the photograph may look different from the dies you have but the sandwich will be the same as outlined below.

You will need:
Big Shot / Big Kick Machine
Multipurpose Platform
2 Cutting Pads
Relevant make of die
Card / Paper

The sandwich is as follows (from bottom to top - as you would build it)


Multipurpose platform open on TAB 2



Add one Cutting Mat



Add Die(s)



Add your card, if using a patterned or finished card the side you want to use needs to be facing the die as even without embossing the dies you do get a slight embossed pattern on certain dies.



Add the other cutting mat

Now everything is layered up as it should be, the pics above have been staggered so you can see what has been layered up, make sure that your sandwich is neat and everything fully covers the layer below it

Sandwich re-cap (starting from the bottom)
~ MP platform - TAB 2
~ Cutting Plate
~ Die (s)
~ Card (front facing die)
~ Cutting Plate

This is now ready to go through your machine

For the next part of this tutorial which is embossing wafer thin dies in the Big Shot click HERE


TOP TIPS!


I have found some of these dies can be a little hard to clean! and have a few tips to help!
To clear the tiny little bits that are left in the die, please do not tap or bang your die against something like other blogs reccomend, they can easily crack and become damaged, I would also avoid scratching at them with a pokey tool or die pic as this will show up on mirri card if you scratch the die.
Instead i reccomend some scotch or low tack tape, press it on the die and peel away the stuck in bits!!

This tip is also good if the actual die cut shape gets stuck too!




Scuse the terribly-in-need-of-a-fresh-coat-of-paint-nail!!

If I get any questions about this tutorial i will add my responses to the bottom to try and help others who may have the same questions

Don't Forget - for the next part of this tutorial which is embossing wafer thin dies in the Big Shot click HERE

Lisa x

4 comments:

cathinka said...

Aah, that's how you do it- and I shall stop using a pin to get them out...great hint, Thanks,
Cathy

Dorothy said...

thank you very much for your helpful website. I recently bought a Marianne die and had no idea how to use it in my Big Shot until I came across your site. Good tip about cleaning out the dies too. Thanks.
Dorothy

Susan Flynn said...

Thanks for all the helpful advice I have just ordered a Big Shot Pro and am reading up in anticipation - can't wait xx

Jenny Ross said...

Great post. Great blog by the way. visited it for first time & just bookmarked it, will love to share this one with our readers at Bipico. Thank you.